Entries from 2015-01-22 to 1 day
1, multi chip package using ceramic multilayer substrate Ceramic multilayer substrates utilised in laptop or computer chip conductors package due to understand high-density packaging, lower signal transmission time on the chip itself, tend…
In recent years, the application of plate steel is a controversial topic, should use steel plate development of desulphurization and deoxidation of steel processing, and performance is to use the plate of degeneration, take the road to mic…